PCB specification  
PCB layer count: 6 layers mobile phone PCB
PCB material: FR4 with Tg135 min
PCB finsihed thickness: 1.0mm +/-0.1mm
PCB surface technique: Immersion gold with minimum gold thickness: 0.05um+hard hole plating connect pads: 30u" min
PCB finished copper thickness: 1 oz for inner layers, 1/3oz+plating for outer layers
PCB minimum hole size: 4mil for micro via holes with laser drilling; 6mil finished through plating hole
PCB minimum track width/spacing: 0.075mm/0.075mm
PCB Solder Mask Color: Light Green with brand Taiyo PSR400
PCB Specialty technology:
<1> Complex impedance
<2> HDI (2+2+2)&Micro via hole
<3> PCB for mobile phone
PCB Specification: IPC class 2 + RoHS

Remark: All TP's PCBs conform to international standards in accordance with MIL, IPC, UL and RoHS. We also conform to the quality standard as ISO 9000 and ISO14000 by DNV